Object

Title: Post-deposition stress evolution in Cu and Ag thin films

Creator:

Chocyk, Dariusz ; Proszyński, Adam ; Gładyszewski, Grzegorz ; Pieńkos, Tomasz ; Gładyszewski, Longin

Contributor:

Gaj, Miron. Redakcja ; Wilk, Ireneusz. Redakcja

Description:

Optica Applicata, Vol. 35, 2005, nr 3, s. 419-424

Abstrakt:

Evolution of stresses in thin Cu and Ag films after deposition by thermal evaporation in UHV system is studied. Thin films were deposited on 100 mm thick Si substrate at room temperature. Deposition rates for the Cu and Ag films were 0.5 A/s and 0.9 A/s, respectively. The total thickness ranged from 7.7 up to 109 nm. The average stress in the films was determined by measuring the radius of samples curvature. The behavior of stress evolution curves is explained by two mechanisms of stress generation: filling grain boundaries and islands coalescence.

Publisher:

Oficyna Wydawnicza Politechniki Wrocławskiej

Place of publication:

Wrocław

Date:

2005

Resource Type:

artykuł

Resource Identifier:

oai:dbc.wroc.pl:72804

Source:

<sygn. PWr A3481II> ; click here to follow the link ; click here to follow the link

Language:

eng

Relation:

Optica Applicata ; Optica Applicata, Vol. 35, 2005 ; Optica Applicata, Vol. 35, 2005, nr 3 ; Politechnika Wrocławska. Wydział Podstawowych Problemów Techniki

Rights:

Wszystkie prawa zastrzeżone (Copyright)

Access Rights:

Dla wszystkich w zakresie dozwolonego użytku

Location:

Politechnika Wrocławska

Group publication title:

Optica Applicata

Objects

Similar

This page uses 'cookies'. More information